CONFIGURATION: PLANE-PARALLEL
DIAMETER: 0.350″+.000″/-.005″
THICKNESS: 0.120″+/-.010″
PARALLELISM: 3 ARC MINUTES MAXIMUM.
FLATNESS: 1/40 WAVE FLAT AT 10.6 MICRONS, 1 FACE.
SURFACE FINISH: 20-10 SCRATCH/DIG PER MIL-O-13830,
1 FACE.
FINE GROUND, 1 FACE.
MATERIAL: SILICON, SINGLE CRYSTAL, MIRROR GRADE.
COATING: ENHANCED COPPER COATED FOR 99.6% MINIMUM
REFLECTANCE AT 10.6 MICRONS WITH A
NORMAL INCIDENCE ANGLE, APPLIED TO POLISH
FACE.
Dimensions | 0.1 in |
---|
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